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MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
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Johann Wiesböck
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News currently running through our ticker
Munich, Germany – 24 April 2025 – When developing applications for autonomous driving, compliance with the ISO 26262 standard is crucial – at both the system and sensor levels. To meet these demands, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XENSIV™ TLE4960x magnetic switch family. Developed in accordance with ISO 26262, the TLE4960x switches integrate diagnostic functions to support functional safety applications with requirements up to ASIL B. They are the only ASIL-B-compliant switches on the market that can address a wide range of automotive applications, including window regulators, sunroof actuators, and seat adjustment. In addition, the devices are AEC-Q100 compliant and qualified to Grade 0, ensuring robust performance in harsh environments.
ROHM Develops New High Power Density SiC Power Modules
Willich-Münchheide, Germany, April 24, 2025 – ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.
Infineon at PCIM Europe 2025: Driving decarbonization and digitalization with innovative semiconductor solutions
Munich, Germany – 23 April 2025 – At PCIM Europe 2025 in Nuremberg, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase its latest semiconductor, software and tooling solutions that help to solve today’s green and digital transformation challenges. At booth #470 in hall 7, the company will present highlights from its extensive power device portfolio, covering all relevant power technologies spanning silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). Under the motto “Driving decarbonization and digitalization. Together”, Infineon will offer numerous demonstrations and presentations as well as the opportunity to talk to its experts.
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