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News currently running through our ticker



ROHM and Nanjing SemiDrive Technology jointly Develop a Reference Design: Utilizing PMICs and SerDes ICs for SoC
Willich-Münchheide, Germany, May 22, 2024 – ROHM and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, have jointly developed a smart cockpit reference design. The design is primarily based on SemiDrive’s X9M and X9E automotive SoCs, and includes PMICs, SerDes ICs, LED driver IC, and other components from ROHM. A reference board based on this design is also available, consisting of three boards: the CoreBoard, the SerDes Board, and the Display Board.

Alps Alpine at PCIM 2024 in Hall 5, Stand 423 – Sensors and ICs for Automotive Applications
Munich, Germany, May 22, 2024 – At this year's PCIM Europe – the leading trade fair for power electronics in Nuremberg, Germany (June 11th – 13th) – Alps Alpine will be presenting a wide range of sensors, sensor modules and ICs developed for the automotive, healthcare, industrial, environmental and energy markets in Hall 5, booth 423.

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Munich, Germany – 15 May 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.



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