10-second intro
to Mexperts:
MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
Mexperts in
a tag cloud:
Agency Profile Team Network Public relations Traditional PR tools Press releases Feature articles Interviews Guest editorials Round-tables Press Tours Press conferences Graphics design Contact management News distribution press contact database E-newsletter for the press Ad-hoc news services Online Press portal Measuring success Press review Online monitoring New media Online Corporate Websites Event Websites Weblications Videos & Multimedia online presentations Newsrooms Video Corporate videos Documentation Interviews Product demos Events Offline CD production Advertising Online & offline Industries & sectors Electronics IT Communication technology Mechanical engineering Automation industries Medical & biotechnology Transportation & logistics renewable energies Environmental technology References Our clients Projects Opinions
What clients and journalists say about us
"The Mexperts work quickly, flexibly and reliably. Furthermore, they know their stuff and understand both the media landscape and the technology. Together, those are exactly the qualities that make life easer for the editor of a trade publication. I value their collaboration highly, and that has been the case for over ten years now."
Dr. Matthias Laasch
Chief Editor, Elektronik Informationen
News currently running through our ticker
Willich-Münchheide, Germany, December 01, 2022 – Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC power devices for automotive applications. A signing ceremony was held at ROHM’s headquarters in Kyoto to commemorate the occasion.
i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost
Munich, Germany – 1 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The new i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones as well as various IoT devices.
Integration of Massive Virtual Test Drives Into DevOps Workflows With DYNA4 Release
Integration of Massive Virtual Test Drives Into DevOps Workflows With DYNA4 Release Stuttgart, GERMANY, 2022-11-30 – Vector introduces Release 7 of DYNA4. The new release fosters the adaption of DevOps workflows in modern vehicle control software development. With its capabilities to generate lightweight simulation packages for Linux environments, massive simulations of virtual test drives can be integrated easily into continuous testing (CT) pipelines.
Legal Notice | Privacy | Disclaimer