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News currently running through our ticker



ROHM and BASiC Semiconductor Form a Strategic Partnership
Willich-Münchheide, Germany, December 01, 2022 – Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC power devices for automotive applications. A signing ceremony was held at ROHM’s headquarters in Kyoto to commemorate the occasion.

i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost
Munich, Germany –  1 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The new i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones as well as various IoT devices.

Integration of Massive Virtual Test Drives Into DevOps Workflows With DYNA4 Release
Integration of Massive Virtual Test Drives Into DevOps Workflows With DYNA4 Release Stuttgart, GERMANY, 2022-11-30 – Vector introduces Release 7 of DYNA4. The new release fosters the adaption of DevOps workflows in modern vehicle control software development. With its capabilities to generate lightweight simulation packages for Linux environments, massive simulations of virtual test drives can be integrated easily into continuous testing (CT) pipelines.



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