10-second intro
to Mexperts:

MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.

What clients and journalists say about us

"I’ve been working in the press department at Infineon for about nine years now, and throughout that time I have always been able to count on the professional support from Mexperts. The "Mexperts" are established experts in their field, and they are very well connected with the journalists who cover the European electronics industry. Even at short notice, the Mexperts reliably and quickly handle the work that has to be done."

Günter Gaugler
Infineon Technologies AG, Senior Director Media Relations

News currently running through our ticker



TE Connectivity presents numerous highlights around connectivity and sensors for future-oriented applications at the SPS trade fair in Nuremberg
Galway (Ireland)– 16 October, 2024 – TE Connectivity, a world leader in connectors and sensors, will be presenting selected product highlights at SPS (12. - 14, 2024) in Hall 10, Stand 130, including the MicroBridge Flexfoil connection solution for boards with fine-pitch connectors.

Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste
Munich, Germany – 16 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is paving the way to a significant reduction of plastic waste and CO2 emissions in the payment card industry. The company today announced the launch of SECORA™ Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials.

HybridPACK™ Drive G2 Fusion: Infineon combines silicon and silicon carbide in a cutting-edge power module for e-mobility
Munich, Germany – 15 October 2024 – Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market. That's why Infineon Technologies AG is introducing the HybridPACK™ Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector. The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. This cutting-edge solution provides an ideal balance between performance and cost efficiency, giving more choice in the optimization of inverters.



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