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MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.

What clients and journalists say about us

"I’ve been working in the press department at Infineon for about nine years now, and throughout that time I have always been able to count on the professional support from Mexperts. The "Mexperts" are established experts in their field, and they are very well connected with the journalists who cover the European electronics industry. Even at short notice, the Mexperts reliably and quickly handle the work that has to be done."

Günter Gaugler
Infineon Technologies AG, Senior Director Media Relations

News currently running through our ticker



Infineon and Vingroup's VinRobotics form partnership to shape the future of humanoid robots
Munich, Germany – Hanoi, Vietnam – 9 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and VinRobotics have signed a Memorandum of Understanding (MoU) to collaborate on the development of humanoid robots. VinRobotics, a Vietnam-based intelligent robotics company established by Vingroup, Vietnam's largest private conglomerate by revenue and a recognized force in the technology sector, brings deep regional expertise and industrial scale to the partnership. As part of this collaboration, a joint competency center will be established at VinRobotics' Hanoi office, serving as a dedicated hub for research, development, and innovation in humanoid robotics.

ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
Willich-Münchheide, Germany, June 09, 2026 – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliability in power conversion circuits for onboard chargers (OBCs) and electric compressors used in xEVs (electric vehicles).

Infineon and Siemens leverage silicon carbide technology to advance electrical protection in data centers and factories
– Infineon and Siemens collaborate to drive semiconductor circuit breaker technology for data centers, production facilities and battery storage systems – Semiconductor circuit breakers are fast-acting, semiconductor-based electronic devices that protect electrical circuits and components from damage caused by short circuits or overloads – Infineon's silicon carbide power modules enhance the efficiency, power density and reliability of the Siemens circuit breaker Munich, Germany – 8 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems. As part of the collaboration, Infineon will supply silicon carbide (SiC) power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers. This will enhance the efficiency, power density and reliability of Siemens' protection solution.



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