10-second intro
to Mexperts:
MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
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What clients and journalists say about us
"Any agency can send out press releases in the form of a serial e-mail. However, there are only a few agencies that have very good relationships with editors and journalists. Nevertheless, to be a very good agency in the high-tech sector, you need even more: experienced staff members that have a solid understanding of their clients’ products and technologies. That’s how you separate the information chaff from the grain in advance. Mexperts has that – and that’s good for us as editors."
Peter Wintermayr
Chief Editor of elektroniknet.de
News currently running through our ticker
Stuttgart, Germany, 2026-04-29 – Vector is expanding its strategic collaboration with NXP® Semiconductors by contributing comprehensive embedded software and system integration expertise to the NXP CoreRide platform – NXP’s scalable foundation for Software-Defined Vehicles (SDVs).
ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables
Willich-Münchheide, Germany, April 28, 2026 – ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.
Infineon provides MEMS technology for Valeo’s ground projection module based on laser beam scanning presented at 2026 Auto Beijing
• Valeo and Infineon are collaborating on a ground projection module to enhance V2X communication and road safety. • They showcase their first product at AutoBeijing, integrating Infineon’s MEMS technology into Valeo’s short distance HD and bi-color projection module. Munich, Germany – 27 April 2026 — Infineon Technologies AG FSE: IFX / OTCQX: IFNNY) a global leader in semiconductor and sensor solutions, and Valeo, a global leader in automotive lighting, are collaborating on a short distance ground projection module integrating Laser Beam Scanning (LBS). Their first collaborative innovation is showcased at 2026 AutoChina in Beijing, China, at the Valeo booth (Hall B2 Booth B2D01).
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