10-second intro
to Mexperts:
MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
Mexperts in
a tag cloud:
Agency Profile Team Network Public relations Traditional PR tools Press releases Feature articles Interviews Guest editorials Round-tables Press Tours Press conferences Graphics design Contact management News distribution press contact database E-newsletter for the press Ad-hoc news services Online Press portal Measuring success Press review Online monitoring New media Online Corporate Websites Event Websites Weblications Videos & Multimedia online presentations Newsrooms Video Corporate videos Documentation Interviews Product demos Events Offline CD production Advertising Online & offline Industries & sectors Electronics IT Communication technology Mechanical engineering Automation industries Medical & biotechnology Transportation & logistics renewable energies Environmental technology References Our clients Projects Opinions
What clients and journalists say about us
"Reliability, flexibility and service should be “a given” for PR agencies. These are exactly the attributes that Mexperts demonstrates! In the area of media relations, in the electronics industry, and in the area of new media, Mexperts is an outstanding partner to support and supplement media relations for a high-tech company! Compared to the “big names” they might be small, but they do high-quality work!"
Ralph Heinrich
Qimonda AG, Public Relations
News currently running through our ticker
Munich, Germany – 12 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the XDP8HD40S-1, a high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 Volt and 800 Volt direct current (VDC). As AI clusters scale from 48 V toward higher rack power levels, reliable hot-swap functionality becomes increasingly important for maintaining uninterrupted system operation. The XDP8HD40S-1 enables power modules, converters, GPUs, and server subsystems to be connected and disconnected safely while preserving system integrity, extending Infineon's power semiconductor portfolio, spanning silicon, silicon carbide (SiC), and gallium nitride (GaN), further into the protection and monitoring layer required for scalable AI infrastructure.
ROHM Showcases Technologies Powering AI, Next-Generation Mobility and Industrial Innovation at electronica 2026
Willich, Germany, October 8, 2026 – ROHM Semiconductor Europe will return to electronica 2026, taking place from 10 to 13 November 2026 in Munich, Germany. Visitors can meet the ROHM team at Hall C3, Booth 520, where the company will showcase its latest power and analog semiconductor solutions for AI infrastructure, electric mobility, industrial automation, and next-generation electronic systems.
Infineon introduces 27 kW three-phase PSU solution for next-generation AI server power architectures
Munich, Germany – 8 October 2026 – Artificial intelligence workloads are redefining the power requirements of modern data centers. Increasing GPU performance and rising rack densities are driving a shift toward 800 VDC or ±400 VDC power supply architectures. To address these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching a 27kW three-phase power supply unit (PSU) solution for server ODMs and OEMs. The reference design meets the requirements of the OCP Open Rack V3 (ORV3) specification and AI server rack architectures, further expanding Infineon’s comprehensive portfolio for powering AI servers. The solution helps developers shorten time-to-market while improving rack power density, efficiency, and thermal performance.
Legal Notice | Privacy | Disclaimer
