10-second intro
to Mexperts:
MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
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What clients and journalists say about us
"Reliability, flexibility and service should be “a given” for PR agencies. These are exactly the attributes that Mexperts demonstrates! In the area of media relations, in the electronics industry, and in the area of new media, Mexperts is an outstanding partner to support and supplement media relations for a high-tech company! Compared to the “big names” they might be small, but they do high-quality work!"
Ralph Heinrich
Qimonda AG, Public Relations
News currently running through our ticker
Willich-Münchheide, Germany, May 21, 2026 – ROHM has developed new Electro-Static Discharge (ESD) protection diodes – the RESDxVx series – that achieve both industry-leading low dynamic resistance (Rdyn) and ultra-low capacitance. This makes them suitable for a wide range of high-speed data communication applications.
TE Connectivity introduces latest lockable AMP Max high-performance connectors for sealed and unsealed applications
GALWAY, Ireland – May 21, 2026 – TE Connectivity, a world leader in connectors and sensors, is expanding its board-connectivity portfolio with the introduction of latest AMP Max high-performance connectors. These connectors offer exceptional current carrying capacity and a compact design that reduces space requirements, making them highly suitable for ventilation and air conditioning, warehouse automation, power systems, robotics or humanoids and other applications, such as control systems, solar inverters, energy storage, and lighting.
Infineon CoolGaN™ BDS 40 V G3 family delivers up to 82 percent footprint reduction for portable power designs
Munich, Germany – 20 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward. Targeting compact consumer devices, the new devices give power system designers greater flexibility to optimize efficiency and streamline designs without sacrificing performance.
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