10-second intro
to Mexperts:

MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.

What clients and journalists say about us

"I’ve been working in the press department at Infineon for about nine years now, and throughout that time I have always been able to count on the professional support from Mexperts. The "Mexperts" are established experts in their field, and they are very well connected with the journalists who cover the European electronics industry. Even at short notice, the Mexperts reliably and quickly handle the work that has to be done."

Günter Gaugler
Infineon Technologies AG, Senior Director Media Relations

News currently running through our ticker



Infineon advances GaN ease-of-use with integrated half-bridge solutions launching CoolGaN™ Drive HB 600 V G5
Munich, Germany – 26 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ portfolio with the CoolGaN Drive HB 600 V G5 product family. The four new devices – IGI60L1111B1M, IGI60L1414B1M, IGI60L2727B1M, and IGI60L5050B1M – integrate two 600 V GaN switches in a half-bridge configuration together with integrated high- and low-side gate drivers and a bootstrap diode, delivering a compact, thermally optimized power stage that further reduces design complexity. By bringing key functions into one optimized package, the family lowers external component count, eases PCB layout challenges typically associated with fast-switching GaN and helps designers shorten development cycles while achieving the core advantages of GaN technology: higher switching frequencies, lower switching and conduction losses, and greater power density.

Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026
Munich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced microcontrollers (MCUs) that process and analyze this data. At embedded world 2026, taking place from 10 to 12 March 2026 in Nuremberg, Germany, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovative semiconductor solutions enable green and efficient energy, clean and safe mobility, and an intelligent and secured IoT. True to the motto “Driving decarbonization and digitalization. Together.” the Infineon booth in Hall 4A, booth 138 will present highlights for applications ranging from AI and IoT to automotive and robotics that contribute to a more sustainable future.

Infineon Annual General Meeting approves stable dividend of €0.35 per share / Management Board and Supervisory Board discharged by large majority
Munich, Germany – 19 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully held its 26th Annual General Meeting. The event took place in person in Munich and was also broadcast publicly on the company’s website.



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