10-second intro
to Mexperts:

MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.

What clients and journalists say about us

"I’ve been working in the press department at Infineon for about nine years now, and throughout that time I have always been able to count on the professional support from Mexperts. The "Mexperts" are established experts in their field, and they are very well connected with the journalists who cover the European electronics industry. Even at short notice, the Mexperts reliably and quickly handle the work that has to be done."

Günter Gaugler
Infineon Technologies AG, Senior Director Media Relations

News currently running through our ticker



ams OSRAM unveils breakthrough Thin-Film VCSEL for AI Scale-Up, showcasing connectorized multi-core fiber solution and expanding ecosystem network
Moving data efficiently is becoming one of the defining challenges of next-generation AI systems. As AI clusters continue to scale, optical interconnects are emerging as critical technology for enabling higher bandwidth at significantly lower power consumption.

Infineon EiceDRIVER™ 2EDL6014AC-G2D dual channel gate driver delivers high density and thermal performance for AI datacenter power designs
Munich, Germany – 17 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the EiceDRIVER™ 2EDL6014AC-G2D, a 120 V junction-isolated dual channel floating output gate driver engineered for high-density silicon power designs in AI datacenter applications. Housed in a compact WQFN-12 2.2 mm x 2.2 mm package, the device addresses the growing demand for power conversion solutions that deliver higher server rack density without sacrificing reliability or thermal performance. The 2EDL6014AC-G2D supports dual high-side, dual low-side, and half-bridge configurations, making it a versatile platform driver across the switched-capacitor and multilevel topologies increasingly adopted in next-generation AI server power architectures.

ROHM's Silicon Carbide contributes to the “Neue Klasse” Electric Powertrain Architecture of BMW
Willich-Münchheide, September 17, 2026 – ROHM Semiconductor announces that its innovative power semiconductor solutions are being utilized in electric vehicle platforms from a leading global premium automotive manufacturer. In BMW’s “Neue Klasse”, ROHM’s SiC (Silicon Carbide) chips support the efficiency, performance, and reliability of the vehicle's electric powertrain systems.



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