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MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.

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"Working together with Mexperts is very efficient for us as editors, because they combine technical understanding with editorial expertise. The long-standing staff members at Mexperts not only know their clients’ technologies and products, they also know – based on their own personal experience – what information we need and what form and format we need to have it in."

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News currently running through our ticker



Infineon named as the Company to Beat in AI Data Center Power Semiconductors by Gartner® as of May 18, 2026
Munich, 26 June 2026 – In a recent report AI Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors, Gartner® examined the fast-evolving market for AI data center power semiconductors and identified Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) as "the company to beat" in this space. The report cites Infineon's 'comprehensive product portfolio, manufacturing capabilities and early investment in advanced technologies' as the decisive factors behind its company-to-beat status. According to Gartner, Infineon's front-runner position is being tested by growing competition in silicon carbide (SiC) and gallium nitride (GaN) and by rivals focused on the compute board level, dynamics that Infineon is actively addressing through its broad portfolio and system-level expertise.

TE Connectivity expands 1.27 mm pitch board-connector-portfolio with SMC connector series
GALWAY, Ireland – June 25, 2026 – TE Connectivity, a world leader in connectors and sensors, is presenting their latest AMP SMC essential connector with a 1.27 mm pitch. It complements the existing fine pitch portfolio and, thanks to various configurations, offers developers and designers a wide range of options to tailor their board-to-board and board-to-wire solutions even better to the requirements of the various applications.

Infineon introduces the AIROC™ UWB TSL100 for precise positioning and smart presence detection on a single chip
Munich, Germany – 25 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ UWB TSL100, the company’s first-generation ultra-wideband (UWB) product family for precise positioning and smart presence detection. As part of Infineon’s AIROC portfolio, the TSL100 features a new architecture aimed at reducing power consumption and enhancing security. The product family marks the start of a scalable UWB platform intended to support future standards such as IEEE 802.15.4ab and is compliant with industry consortium standards such as CCC, Aliro, and FiRa. The TSL100 combines ranging and sensing capabilities in a single device, enabling applications such as secured vehicle access, in-cabin presence detection, access control, contactless payment, ticketing, and indoor navigation, as well as industrial use cases including asset tracking and collision avoidance. With the introduction of the AIROC™ UWB TSL100, Infineon strengthens its position in secured connected systems and expands its AIROC™ wireless portfolio with a new family of UWB devices. These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer, and industrial markets.



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