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MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
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What clients and journalists say about us
"MEXPERTS has been supporting Altera with press relations for over ten years now. The success of this long-term collaboration alone speaks for itself in our dynamic industry. We particularly appreciate their technical and communication skills, the timely implementation of our PR campaigns, the continuity of the work with our contact within the agency, and the intensive contact with journalists. This high-tech agency from Munich has also been coordinating our Europe-wide PR network successfully for the past several years."
Udo Renz
Managing Director, Altera GmbH
News currently running through our ticker
Premstaetten, Austria (June 10, 2026) -- ams OSRAM (SIX: AMS) announces that all voting items on the agenda at the Annual General Meeting of ams-OSRAM AG were approved by a clear majority. The Supervisory Board members Andreas Gerstenmayer and Arunjai Mittal were elected for a new term of office until the Annual General Meeting 2030.
Infineon and Vingroup's VinRobotics form partnership to shape the future of humanoid robots
Munich, Germany – Hanoi, Vietnam – 9 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and VinRobotics have signed a Memorandum of Understanding (MoU) to collaborate on the development of humanoid robots. VinRobotics, a Vietnam-based intelligent robotics company established by Vingroup, Vietnam's largest private conglomerate by revenue and a recognized force in the technology sector, brings deep regional expertise and industrial scale to the partnership. As part of this collaboration, a joint competency center will be established at VinRobotics' Hanoi office, serving as a dedicated hub for research, development, and innovation in humanoid robotics.
ROHM launches New Top-Side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
Willich-Münchheide, Germany, June 09, 2026 – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliability in power conversion circuits for onboard chargers (OBCs) and electric compressors used in xEVs (electric vehicles).
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