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Infineon and SOLUM strengthen collaboration on HVDC power solutions for AI data centers
Munich, Germany and Seoul, South Korea – 5 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and SOLUM have signed a Memorandum of Understanding (MoU) to strengthen their existing collaboration on high-voltage direct current (HVDC) power solutions for AI data centers. Building on their ongoing technical cooperation, the companies plan to expand their work across three key power applications: intermediate bus converters (IBCs), battery backup units (BBUs) and power supply units (PSUs).

Infineon redefines real-time compute and control for software-defined vehicles and Physical AI with new AURIX™ RC1
–    Fundamentally new automotive microcontroller platform is Infineon’s first to leverage the open-standard instruction set architecture RISC-V –    Platform simplifies development of software-defined vehicles by providing one common, highly scalable microcontroller basis across domains instead of point solutions –    High-end product lineup within the family will extend microcontroller domain with additional microprocessor capabilities to support further integration of functions –    Advanced processing, safety, cybersecurity, and integrated networking capabilities provide future-ready foundation for evolving requirements throughout vehicle lifecycles –    Complementing software ecosystem reduces migration efforts and accelerates software development for customers Munich, Germany – 4 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking a strategic step forward to expand its portfolio for software-defined vehicles (SDV) as well as other software-defined (SDX) and Physical AI applications, reinforcing its position as global market leader in microcontrollers (MCU). The company is introducing a fundamentally new MCU platform within its industry-leading AURIX™ series for real-time control in automotive and beyond. AURIX RC1 is Infineon’s first MCU platform that leverages the benefits of RISC-V. Scaling from traditional microcontrollers to hybrid microcontroller/microprocessor devices, it provides a new level of power-efficient real-time intelligence to enable safe and secured future SDV, SDX and Physical AI. Infineon will present the AURIX RC1 family concept at the electronica trade fair in Munich, Germany (10-13 November) and targets to provide samples in the first half of 2027.

Infineon launches OptiMOS™ 7 40 V MOSFETs to improve efficiency and power density in AI server and telecom power conversion
Munich, Germany – 03 November 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching its OptiMOS™ 7 40 V switching-optimized power MOSFET portfolio for AI servers, data centers and telecom infrastructure. Designed for high-frequency DC-DC power conversion, the devices help designers improve efficiency and power density in space-constrained systems. Target applications include low-voltage secondary-side stages of high-voltage intermediate bus converters in emerging 800 V DC architectures and intermediate bus converters in 48 V power architectures, with switching frequencies beyond 1 MHz supported in suitable topologies.



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