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MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.
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What clients and journalists say about us
"MEXPERTS has been supporting Altera with press relations for over ten years now. The success of this long-term collaboration alone speaks for itself in our dynamic industry. We particularly appreciate their technical and communication skills, the timely implementation of our PR campaigns, the continuity of the work with our contact within the agency, and the intensive contact with journalists. This high-tech agency from Munich has also been coordinating our Europe-wide PR network successfully for the past several years."
Udo Renz
Managing Director, Altera GmbH
News currently running through our ticker
GALWAY, Ireland – June 25, 2026 – TE Connectivity, a world leader in connectors and sensors, is presenting their latest AMP SMC essential connector with a 1.27 mm pitch. It complements the existing fine pitch portfolio and, thanks to various configurations, offers developers and designers a wide range of options to tailor their board-to-board and board-to-wire solutions even better to the requirements of the various applications.
Infineon introduces the AIROC™ UWB TSL100 for precise positioning and smart presence detection on a single chip
Munich, Germany – 25 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the AIROC™ UWB TSL100, the company’s first-generation ultra-wideband (UWB) product family for precise positioning and smart presence detection. As part of Infineon’s AIROC portfolio, the TSL100 features a new architecture aimed at reducing power consumption and enhancing security. The product family marks the start of a scalable UWB platform intended to support future standards such as IEEE 802.15.4ab and is compliant with industry consortium standards such as CCC, Aliro, and FiRa. The TSL100 combines ranging and sensing capabilities in a single device, enabling applications such as secured vehicle access, in-cabin presence detection, access control, contactless payment, ticketing, and indoor navigation, as well as industrial use cases including asset tracking and collision avoidance. With the introduction of the AIROC™ UWB TSL100, Infineon strengthens its position in secured connected systems and expands its AIROC™ wireless portfolio with a new family of UWB devices. These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer, and industrial markets.
Infineon RASIC™ CTRX8188F enters mass production as automotive industry's first 8Tx8Rx imaging radar MMIC, accelerating the shift to centralized radar architectures
Munich, Germany – 24 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has started the production of the RASIC™ CTRX8188F, a next-generation 8Tx8Rx radar transceiver that positions Infineon at the forefront of the rapidly expanding automotive 4D and HD imaging radar market. The device is ready for production engineered to support edge processing in combination with AURIXTM TC45 and is the first MMIC in the market which enables centralized radar architectures. Centralized radar systems adopt an emerging design approach in which raw sensor data is transmitted directly to a central vehicle computer for processing. This new concept reduces overall system cost while improving performance significantly over conventional edge-processing designs. As automakers and Tier-1 suppliers accelerate investment in advanced driver assistance systems (ADAS) and autonomous driving platforms, the CTRX8188F provides customers with a competitive, production-ready solution that addresses both cost and performance requirements.
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