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MEXPERTS – the MEdia EXPERTs for your B2B/B2C communications! Since 1993, our PR and multimedia agency has been successfully serving as a liaison between innovative high-tech companies on one hand and the trade, general, and business press on the other. Our experienced team has both a technical and journalistic background and is committed to helping you succeed by employing creative ideas, an outstanding network of contacts, novel technologies and the latest communication channels.

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"Any agency can send out press releases in the form of a serial e-mail. However, there are only a few agencies that have very good relationships with editors and journalists. Nevertheless, to be a very good agency in the high-tech sector, you need even more: experienced staff members that have a solid understanding of their clients’ products and technologies. That’s how you separate the information chaff from the grain in advance. Mexperts has that – and that’s good for us as editors."

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Chief Editor of elektroniknet.de

News currently running through our ticker



Infineon and Siemens leverage silicon carbide technology to advance electrical protection in data centers and factories
– Infineon and Siemens collaborate to drive semiconductor circuit breaker technology for data centers, production facilities and battery storage systems – Semiconductor circuit breakers are fast-acting, semiconductor-based electronic devices that protect electrical circuits and components from damage caused by short circuits or overloads – Infineon's silicon carbide power modules enhance the efficiency, power density and reliability of the Siemens circuit breaker Munich, Germany – 8 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems. As part of the collaboration, Infineon will supply silicon carbide (SiC) power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers. This will enhance the efficiency, power density and reliability of Siemens' protection solution.

ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance
Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s device was selected as a SiC power device that supports next-generation power supply systems.

Infineon advances Physical AI security against quantum-era threats with certified TPM solution for NVIDIA Jetson Thor
Munich, 03 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announces the integration of its OPTIGA™ Trusted Platform Module (TPM) SLB 9672 with NVIDIA’s Jetson Thor platform. The hardware-based security solution securely stores cryptographic keys and verifies system integrity at the chip level, establishing a certified, quantum-resilient root of trust for Physical AI systems. The integration strengthens the security foundation, enabling robots and autonomous systems to operate securely and reliably across their full lifecycle. As these systems move from controlled environments into factories and public spaces, the impact of a security failure extends beyond data loss to operational disruption and regulatory liability. For the robotics industry, the security architecture decisions made at design-in have lasting commercial and compliance implications.



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